Feature:

NC-559-ASM TPF Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Paste

NC-559 as a leave-in help paste residue color is very light, there is a very value of SIR.

Recommended for BGA, CSP and other solder ball array repair and fill the ball.

When using smoke less, no residue. Affordable.

Suitable for :

North and south bridge, cards, cell phone chip, video chip BGA solder, bumping.

Also can use off the tin, the effect is very ideal.

The residue was less bright spot, less smoke, no pungent odor, do not run the ball.

Package Included:

1 x Solder paste